Company Filing History:
Years Active: 1998-2010
Title: The Innovative Contributions of Rickey S Brownson
Introduction
Rickey S Brownson is a notable inventor based in Cedar Park, TX (US). He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work has been instrumental in advancing the methods used in semiconductor device fabrication.
Latest Patents
One of Rickey's latest patents is titled "Semiconductor fin integration using a sacrificial fin." This patent describes a method for forming a semiconductor device by removing portions of a sacrificial layer to expose a first seed layer region. The process involves depositing an epitaxial semiconductor material over the first seed layer region and forming a capping layer that overlies both the epitaxial material and the remaining portion of the sacrificial layer. The method continues with the removal of portions of the capping layer to create a capping structure, followed by the formation of fin structures adjoining the sidewalls of the sacrificial structure. Another significant patent is "Forming semiconductor fins using a sacrificial fin," which outlines steps for creating fin structures adjacent to recessed sidewalls of an intermediate structure.
Career Highlights
Throughout his career, Rickey has worked with prominent companies in the semiconductor industry, including Motorola Corporation and Freescale Semiconductor, Inc. His experience in these organizations has allowed him to develop and refine his innovative techniques in semiconductor device manufacturing.
Collaborations
Rickey has collaborated with several talented individuals in his field, including David A Abercrombie and Michael R Cherniawski. These collaborations have contributed to the successful development of his patented technologies.
Conclusion
Rickey S Brownson's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of semiconductor device fabrication.