Company Filing History:
Years Active: 2008
Title: Richard Yabuki - Innovator in Bump Technology
Introduction
Richard Yabuki is an accomplished inventor based in Garden Grove, California. He holds a notable patent that demonstrates a significant advancement in the field of contact bump technology. Yabuki’s contributions to the realm of inventions highlight his commitment to improving existing methodologies in electronics.
Latest Patents
Richard Yabuki is credited with one primary patent: the Stacked Contact Bump. This innovative design offers a novel method for creating bump structures suitable for conventional stud bump bonding techniques. The patent describes an arrangement where bumps can be configured in a buttressed format, allowing for substantial lateral and vertical contact loads, in addition to achieving considerable heights. Furthermore, the stacked bump contact can be established in a side-by-side configuration, rendering it significantly taller and stronger than current alternatives. The design also allows for various arrangements to optimize load bearing capacity across different directions.
Career Highlights
Yabuki currently works at Touchdown Technologies, Inc., where he applies his expertise in developing advanced electronic components. His role involves utilizing his inventive talents to create solutions that enhance the capabilities of technology in the industry.
Collaborations
In his professional journey, Richard collaborates with colleagues such as Nim Tea, leveraging teamwork to push the boundaries of innovation. Their joint efforts contribute to the ongoing success of Touchdown Technologies and reflect the collaborative spirit necessary for groundbreaking inventions.
Conclusion
With his inventive mind and practical applications, Richard Yabuki stands out in the technology sector, particularly for his work on the Stacked Contact Bump patent. His dedication to innovation through impactful designs positions him as a valuable inventor in modern electronics. The implications of his work continue to inspire advancements and improve component efficiency in various applications.