Boise, ID, United States of America

Richard Wallace Hoefer


Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 68(Granted Patents)


Company Filing History:


Years Active: 2003-2006

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Richard Wallace Hoefer: Innovator in Nonwoven Materials

Introduction

Richard Wallace Hoefer is a notable inventor based in Boise, ID (US). He has made significant contributions to the field of nonwoven materials, holding 2 patents that showcase his innovative approach to material production.

Latest Patents

Hoefer's latest patents include "Controlled loft and density nonwoven webs and method for producing same." This invention features a lofty, nonwoven material characterized by a web containing a plurality of substantially continuous fibers oriented in a z-direction. The method for producing this material is efficient, as it requires no mechanical manipulation of the fibers, allowing for fast and easily adjustable in-line processing. The resulting material can be tailored to have varying web structures, from predominantly open to predominantly closed.

Career Highlights

Richard Hoefer is currently employed at Kimberly-Clark Worldwide, Inc., where he continues to develop innovative solutions in the nonwoven materials sector. His work has contributed to advancements in the production and application of nonwoven fabrics.

Collaborations

Throughout his career, Hoefer has collaborated with notable colleagues, including James Richard Neely and Edward Jason White. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Richard Wallace Hoefer's contributions to the field of nonwoven materials exemplify his commitment to innovation and efficiency. His patents reflect a deep understanding of material science and a dedication to advancing technology in this area.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…