Richard M Port

Title: Innovations in Circuit Interconnect Technology: The Contributions of Richard M. Port

Introduction

Richard M. Port, an influential inventor based in Santa Monica, California, has made significant strides in the field of circuit interconnect technology. With one patent to his name, he has developed an innovative approach that promises to enhance the performance and efficiency of multichip modules.

Latest Patents

Port's notable patent, titled "Orthogonal grid circuit interconnect method," revolutionizes the way low-cost, high-density circuits are manufactured. This method employs a two-layer interconnect pattern featuring parallel line segments arranged orthogonally, creating a mesh-like structure when viewed through the dielectric film. The intricate design includes signal lines connected through metalized vias, strategically placed to reduce crosstalk between the long parallel segments. Additionally, power and ground lines are integrated within the grid to form interconnected mesh planes, further optimizing signal integrity.

The uniqueness of Port's invention lies not only in its design but also in the construction method. By enabling the simultaneous formation of circuit patterns and vias through a single set of plating operations, the process becomes environmentally friendly with minimal subtractive etching required, leading to a significant reduction in production costs. With line feature sizes shrinking to 25 microns or smaller, the circuits are designed to accommodate various mounting techniques while offering lower resistance—typically 40 percent lower than circuits utilizing aluminum conductors.

Career Highlights

Port’s career is prominently marked by his work at Hughes Aircraft Company, where he has contributed significantly to advancements in electronic design and manufacturing. His technical expertise and innovative spirit embody the pioneering efforts in the aerospace and defense sectors.

Collaborations

During his tenure, Port collaborated with a notable colleague, Louis E. Gates, Jr., sharing insights and innovations that advanced the functionality of integrated circuits. Their partnership reflects the collaborative nature of technological advancements in modern engineering.

Conclusion

Richard M. Port stands as a testament to the power of innovation in circuit interconnect technology. With his patent on the orthogonal grid circuit interconnect method, he has paved the way for more efficient and cost-effective electronic solutions, benefiting industries that rely on high-density circuits. His contributions not only enhance performance but also highlight the importance of environmentally conscious manufacturing processes in today’s technological landscape.