Richard K West

Title: The Innovative Contributions of Richard K West

Introduction

Richard K West is a notable inventor based in Poughkeepsie, NY (US). He has made significant contributions to the field of semiconductor technology. His innovative methods have paved the way for advancements in interconnection levels within semiconductor chips.

Latest Patents

Richard K West holds a patent for a method titled "Method for simultaneously forming an interconnection level and via studs." This method involves forming a level of interconnection metallurgy over an insulating layer of a semiconductor chip. The process includes creating via holes in the insulating layer, high-mobility sputtering of conductive material, and ion beam milling to create a patterned interconnection layer. The high-mobility sputtering technique is crucial as it ensures a planar conductive layer and fills via holes without void formation. This method is particularly beneficial for multiple interconnection level designs and large diameter wafer fabrication.

Career Highlights

Richard K West is associated with the International Business Machines Corporation, commonly known as IBM. His work at IBM has been instrumental in advancing semiconductor technologies. He has focused on enhancing the efficiency and density of interconnection levels in semiconductor devices.

Collaborations

Throughout his career, Richard has collaborated with notable colleagues such as Paul N Chaloux, Jr and Thomas F Houghton. These collaborations have contributed to the development of innovative solutions in the semiconductor industry.

Conclusion

Richard K West's contributions to semiconductor technology through his innovative patent demonstrate his expertise and commitment to advancing the field. His work continues to influence the design and fabrication of semiconductor devices.