Company Filing History:
Years Active: 2001-2013
Title: Richard John Benney: Innovator in Parachute Technology
Introduction
Richard John Benney is a notable inventor based in Stow, MA (US). He has made significant contributions to the field of parachute technology, holding a total of 3 patents. His work focuses on enhancing the safety and efficiency of aerial delivery systems.
Latest Patents
One of his latest patents is the "Multiple Bundle Sling Load System." This innovative system includes a sling for attachment to an aircraft, a support system suspended from the sling for carrying multiple bundles, and a load release mechanism interconnecting each bundle with the support structure. It also features a parachute associated with at least one of the bundles, along with a parachute release mechanism for air drop and land drop operations.
Another significant patent is the "Soft Landing Assembly for a Parachute." This assembly incorporates an altitude sensor mounted on the parachute and a control assembly for activating parachute landing velocity affectors at preselected altitudes. The system aims to reduce both horizontal and vertical velocities at optimal times, ensuring a safer landing for parachutists.
Career Highlights
Richard John Benney works for the U.S. Government as represented by the Secretary of the Army. His role involves developing advanced technologies that enhance military operations and safety during aerial deployments.
Collaborations
Throughout his career, Richard has collaborated with notable colleagues such as Glen J. Brown and Marc N. Tardiff. Their combined expertise has contributed to the successful development of innovative parachute systems.
Conclusion
Richard John Benney's contributions to parachute technology demonstrate his commitment to innovation and safety in aerial operations. His patents reflect a deep understanding of the complexities involved in aerial delivery systems, making him a valuable asset in his field.