Company Filing History:
Years Active: 2020-2024
Title: Richard James Dowling: Innovator in Integrated Circuit Technology
Introduction
Richard James Dowling is a notable inventor based in Temecula, CA (US). He has made significant contributions to the field of integrated circuits, holding a total of 3 patents. His work focuses on addressing thermal conductivity issues in FET IC structures, showcasing his innovative approach to technology.
Latest Patents
One of Richard's latest patents is titled "Thermal extraction of single layer transfer integrated circuits." This patent describes a FET IC structure made using a back-side access process that mitigates or eliminates thermal conductivity problems. In various embodiments, electrically-isolated thermal paths are formed adjacent to the FET, configured to conduct heat laterally away from the FET to generally orthogonal thermal pathways. This design allows heat to be directed to thermal pads that are externally accessible at the top of the completed IC. Additionally, in some embodiments that utilize a thermally-conductive handle wafer, thermal vias are formed to ensure thermal contact with the handle wafer and the conventional metallization layers of the device superstructure. The innovative use of dummy gates in some embodiments further enhances the lateral thermal paths, effectively conducting heat away from the FET.
Career Highlights
Richard has worked with prominent companies in the technology sector, including Psemi Corporation and Murata Manufacturing Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge advancements in integrated circuit technology.
Collaborations
Throughout his career, Richard has collaborated with talented individuals such as Abhijeet Paul and Hiroshi Yamada. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.
Conclusion
Richard James Dowling is a distinguished inventor whose work in integrated circuit technology has made a lasting impact. His innovative patents and collaborations reflect his commitment to advancing the field and addressing critical challenges in thermal management.