Liverpool, NY, United States of America

Richard J Williams


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1995

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1 patent (USPTO):Explore Patents

Title: Richard J Williams: Innovator in Substrate Purification

Introduction

Richard J Williams is a notable inventor based in Liverpool, NY (US). He has made significant contributions to the field of electronics through his innovative methods for purifying substrates from unwanted heavy metals. His work addresses critical issues in the production of electronic circuitry, ensuring better performance and reliability.

Latest Patents

Richard J Williams holds a patent for a method of purifying substrate from unwanted heavy metals. This patent focuses on the challenges posed by impurities such as cadmium and tellurium, which are often by-products of copper mining. The method involves forming a sacrificial layer of mercury telluride or mercury cadmium telluride on the substrate, followed by annealing the combination at elevated temperatures with an overpressure of mercury. This process allows for the removal of the sacrificial layer along with a contiguous portion of the substrate, enhancing the electrical performance of the circuitry.

Career Highlights

Richard J Williams is associated with Martin Marietta Corporation, where he has been able to apply his expertise in substrate purification. His innovative approach has contributed to advancements in the field of electronic materials, making a significant impact on the industry.

Collaborations

Throughout his career, Richard has collaborated with esteemed colleagues such as Gregory K Dudoff and Karl A Harris. These collaborations have fostered an environment of innovation and have led to the development of effective solutions in substrate purification.

Conclusion

Richard J Williams is a pioneering inventor whose work in substrate purification has the potential to revolutionize the electronics industry. His innovative methods not only address existing challenges but also pave the way for future advancements in electronic circuitry.

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