Company Filing History:
Years Active: 1979-1994
Title: The Innovations of Richard H. Kurth: Patents and Contributions
Introduction
Richard H. Kurth is a notable inventor based in Palo Alto, California, recognized for his contributions to technology with two significant patents. His work primarily focuses on advanced soldering techniques and precision in inkjet technology, reflecting his expertise in materials engineering and fabrication processes.
Latest Patents
Among his latest innovations, Richard Kurth holds a patent for "Lasersonic Soldering of Fine Insulated Wires to Heat-Sensitive Substrates." This method ingeniously combines laser and ultrasonic energy to solder insulated wires to pads on heat-sensitive substrates, making it particularly beneficial in applications like connecting thin-film magnetic heads to circuit carrier substrates.
Another remarkable patent is the "Process for Producing Uniform Nozzle Orifices in Silicon Wafers." This process innovatively addresses the challenge of producing nozzle plates for inkjet recording by etching through silicon wafers efficiently. The technique ensures uniformity in nozzle size and structure, enhancing the performance of inkjet printers.
Career Highlights
Richard Kurth has made significant strides in his career at International Business Machines Corporation (IBM), contributing to pioneering projects that leverage his technical skills and inventive spirit. His patents demonstrate a keen understanding of complex engineering challenges and the drive to develop practical solutions.
Collaborations
Throughout his career, Richard has collaborated with esteemed colleagues such as Pedro A. Chalco and Wesley LeRoy Hillman. These partnerships have fostered innovative approaches, combining diverse expertise to further advancements in their respective fields.
Conclusion
In summary, Richard H. Kurth exemplifies the spirit of innovation through his patents and collaborations at IBM. His contributions to soldering techniques and inkjet technology highlight the impact of inventive thinking in pushing the boundaries of engineering and technology.