Richard H Jones

Title: Richard H Jones: Innovator in High Density Integrated Systems

Introduction

Richard H Jones is a notable inventor based in Wayne, PA (US). He has made significant contributions to the field of electronic equipment packaging, particularly in data processing systems. His innovative approach has led to advancements in high density integrated circuits.

Latest Patents

Richard H Jones holds a patent for an "Island assembly employing cooling means for high density integrated." This system provides for high density packaging of electronic equipment, specifically designed for data processing systems. The invention features subnanosecond integrated circuits of the LSI or MSI type in pluggable packages, which are adapted to be installed in receptacles or connectors. A cooling frame supports the package connectors and the package-to-package interconnection medium. The system allows for groups of integrated circuit packages, logically partitioned into functional elements, to comprise an island. This innovative design can be expanded further by interconnecting several islands.

Career Highlights

Throughout his career, Richard H Jones has been associated with Burroughs, Inc., where he has contributed to various projects and innovations. His work has focused on enhancing the efficiency and performance of electronic systems.

Collaborations

Richard has collaborated with notable coworkers, including Robert E Braun and George J Sprenkle. Their combined expertise has fostered a creative environment that has led to significant advancements in their field.

Conclusion

Richard H Jones is a distinguished inventor whose work in high density integrated systems has made a lasting impact on electronic equipment packaging. His innovative patent and collaborations highlight his commitment to advancing technology in data processing systems.