Title: Richard Grünwald - Innovator in Electronic Component Joining
Introduction: Richard Grünwald is an inventor based in Potsdam, Germany. He is currently associated with Vectron International GmbH, where he focuses on innovative methods for joining electronic components. Although he has not yet been granted any patents, his work is significant in the field of electronics.
Latest Patent Applications: Richard Grünwald has filed a patent application for a method titled "METHOD FOR JOINING A FIRST ELECTRONIC COMPONENT AND A SECOND COMPONENT." This invention relates to a method for joining a first electronic component with a second component using an active brazing alloy. The objective of this invention is to provide a simplified method for achieving a reliable, stress-reduced joint of a high-temperature stable piezoelectric oxidic mono-crystal. According to the method, a first component, which includes a piezoelectric oxidic mono-crystal, is joined with a second component using an active brazing alloy. The active brazing alloy directly contacts the piezoelectric oxidic mono-crystal of the first component.
Conclusion: Richard Grünwald is an emerging inventor whose innovative approach to electronic component joining holds promise for advancements in the field. His contributions, although not yet reflected in granted patents, demonstrate his commitment to developing reliable and efficient methods in electronics.