Richard G Smith

Title: Inventor Richard G. Smith: Pioneering Advances in Copper Interconnections

Introduction

Richard G. Smith, an innovative inventor based in Poughkeepsie, NY, has made significant contributions to the field of electrical engineering, particularly through his advancements in copper interconnections. With 9 patents to his name, his work has helped enhance the efficiency and reliability of electronic components.

Latest Patents

Among his most notable recent patents is the groundbreaking method for forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity. This invention focuses on providing sub-half-micron copper interconnections that exhibit improved electromigration and corrosion resistance. The process employs double damascene technology using electroplated copper, where a seed layer is transformed into an intermetallic layer. Additionally, Richard's method integrates a copper intermetallics layer mixed with hafnium, lanthanum, zirconium, or tin, which significantly improves the performance regarding electromigration and reduces defect sensitivity. Furthermore, he has developed a technique to form a protective cap atop copper lines, enhancing their corrosion resistance by ensuring full surface coverage. His innovative approach extends to improving electromigration and corrosion resistance by incorporating carbon atoms into copper interstitial positions.

Career Highlights

Richard G. Smith works for International Business Machines Corporation (IBM), where he has been instrumental in advancing their technological capabilities. His deep understanding of materials science and electrical engineering has positioned him as a key figure in the development of cutting-edge solutions within the electronics industry.

Collaborations

Throughout his career, Richard has collaborated with talented coworkers, including Hazara Singh Rathore and Du Binh Nguyen. Together, they have navigated complex challenges and shared their expertise to drive forward several groundbreaking projects in electronic engineering.

Conclusion

Richard G. Smith exemplifies the spirit of innovation, continually pushing the boundaries of what's possible in the realm of copper interconnections. His patents signify not only personal achievements but also contribute significantly to the broader technological landscape, paving the way for future advancements in the field. His work at IBM and collaboration with talented colleagues ensures that the pursuit of innovation remains at the forefront of his endeavors.