Richard D Ries

Title: The Innovations of Richard D. Ries

Introduction

Richard D. Ries is a notable inventor based in Saint Paul, MN (US). He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique protective carrier for semiconductor packages.

Latest Patents

Richard D. Ries holds 1 patent for his invention titled "Protective carrier for semiconductor packages." This assembly is designed to releasably mount a semiconductor package with respect to a rigid carrier. It ensures a predetermined alignment with the carrier to protect the package leads and position them for electrical testing. The invention features two substantially identical dielectric frames positioned on opposite sides of the leads, fastened in a sandwich arrangement that encloses remote end portions of the leads. Registration openings at opposed corners of the frames receive registration pins projected from the carrier, allowing for precise positional alignment in transverse directions. Additionally, spring-loaded retainers engage a central body of the semiconductor package to retain it against longitudinal movement relative to the carrier.

Career Highlights

Richard D. Ries has had a distinguished career, working at Control Data Corporation, where he has been able to apply his innovative ideas in a practical setting. His work has contributed to advancements in semiconductor packaging technology.

Collaborations

Throughout his career, Richard has collaborated with notable coworkers such as Dewey W. Smith and Spero Payton. Their combined efforts have fostered an environment of innovation and creativity.

Conclusion

Richard D. Ries exemplifies the spirit of innovation in the semiconductor industry. His contributions have not only advanced technology but also paved the way for future developments in the field.