Richard D Copper

Title: Innovations by Richard D Copper in Semiconductor Technology

Introduction

Richard D Copper is an accomplished inventor based in Sullivan, Indiana, known for his contributions to the field of semiconductor technology. With a total of two patents to his name, he has made significant advancements in the design and functionality of polishing pads used in chemical and mechanical planarization processes.

Latest Patents

Richard's latest patents include a groundbreaking polishing pad designed for use in the chemical and mechanical planarization of semiconductor wafers. This innovative pad features a transparent window that allows for end-point determination during the polishing process. The transparent section is created by directly injecting a polymeric material into a modified portion of the porous polishing pad. This modification can either be a low-density area or a complete vertical section removed from the pad. The injected polymer forms an integral window with the pad, ensuring no additional reinforcement is necessary to hold it in place. In an alternative embodiment, a distinct window-plug can be inserted into a cutout section of the pad, bonded securely by binding film layers on the non-working surface.

Career Highlights

Richard D Copper is currently employed at Raytech Innovative Solutions, LLC, where he continues to develop innovative solutions for the semiconductor industry. His work has been instrumental in enhancing the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Richard has collaborated with notable coworkers, including Angela L Petroski and Paul Fathauer, contributing to a dynamic team focused on advancing technology in their field.

Conclusion

Richard D Copper's innovative work in the semiconductor industry, particularly with his patented polishing pad technology, showcases his commitment to enhancing manufacturing processes. His contributions are vital to the ongoing evolution of semiconductor technology.