Company Filing History:
Years Active: 1993-1995
Title: Innovations of Richard A Mayernik
Introduction
Richard A Mayernik is a notable inventor based in Newark, DE (US). He has made significant contributions to the field of printed circuit board manufacturing. With a total of three patents to his name, Mayernik's work focuses on improving the reliability and performance of electroless copper deposition processes.
Latest Patents
Mayernik's latest patents include an innovative method for electroless copper deposition on printed circuit boards. This method enhances the manufacturing of fully-additive or partly-additive printed wiring boards. The process involves depositing copper on an insulating substratum and the walls of plated-through holes. The resulting copper deposit exhibits increased resistance to failure due to thermal stress or thermal cycling. The electroless copper plating bath utilized in this method contains a copper compound, ethylenediaminetetraacetic acid as a complexing agent, and a reducing agent that converts the copper compound to metallic copper. Additionally, the bath includes inorganic germanium and silicate compounds combined with polyethylene glycol. The pH of the electroless copper bath is carefully monitored and maintained between 11.2 and 12.0 to minimize trace iron codeposition and enhance resistance to thermal cycling failures. Furthermore, the addition of vanadium to the bath improves the smoothness of the deposited copper and increases the number of thermal cycles before failure.
Career Highlights
Mayernik is currently employed at Amp-Akzo Corporation, where he continues to innovate in the field of printed circuit board technology. His work has been instrumental in advancing manufacturing techniques that improve product durability and performance.
Collaborations
Some of Mayernik's coworkers include Eric C Huenger and Stanley W Tarry. Their collaborative efforts contribute to the ongoing development of innovative solutions in the industry.
Conclusion
Richard A Mayernik's contributions to the field of electroless copper deposition have significantly impacted the manufacturing of printed circuit boards. His innovative methods enhance the reliability and performance of these essential components in modern electronics.