Company Filing History:
Years Active: 1977
Title: Richard A. Holcomb: Innovator in Bonding Technologies
Introduction
Richard A. Holcomb is a notable inventor based in Lake Charles, LA (US). He has made significant contributions to the field of bonding technologies, particularly in the area of film-forming metals and their alloys. His innovative methods have the potential to enhance various industrial applications.
Latest Patents
Holcomb holds a patent for a "Process for bonding titanium, tantalum, and alloys thereof." This method involves applying a first coating of a metal, compound, or alloy from the platinum metal group to the film-forming metal. Following this, a second coating of copper is applied to the first coating. This innovative approach allows for the soldering of a second metal, such as steel, to the copper coating, creating a strong and durable bond. This bonding method is particularly useful for soldering titanium screens or meshes to electroconductive metals in the assembly of electrolytic cells for the production of chlorine or oxychlorine compounds. He has 1 patent to his name.
Career Highlights
Richard A. Holcomb is associated with Olin Corporation, where he has been able to apply his expertise in bonding technologies. His work has contributed to advancements in the manufacturing processes within the company, showcasing his commitment to innovation and excellence.
Collaborations
Holcomb has worked alongside notable colleagues such as Peter A. Danna and Richard J. Roethlein. Their collaborative efforts have furthered the development of innovative solutions in their respective fields.
Conclusion
Richard A. Holcomb's contributions to bonding technologies exemplify the impact of innovation in industrial applications. His patented methods not only enhance manufacturing processes but also pave the way for future advancements in the field.