Renuka Muralidhar

Title: Renuka Muralidhar: Innovator in Thermal Cooling Technology

Introduction

Renuka Muralidhar is a notable inventor based in Yorktown Heights, NY (US). She has made significant contributions to the field of thermal management through her innovative patent. Her work focuses on enhancing the efficiency of cooling systems, particularly in enclosures.

Latest Patents

Renuka holds a patent for a method and system titled "Thermal cooling of an enclosure." This invention involves a computer-implemented mitigation and warning method that detects enclosure temperature via a temperature probe. When the temperature exceeds a predetermined threshold, a controller activates a thermoelectric device to transfer heat between the enclosure and a phase change material (PCM). This process causes the PCM to change phase, effectively cooling the enclosure.

Career Highlights

Renuka is currently employed at International Business Machines Corporation, commonly known as IBM. Her role at IBM allows her to work on cutting-edge technologies and contribute to advancements in thermal management solutions.

Collaborations

Renuka collaborates with talented coworkers, including Ayushmaan Aggarwal and Bishwaranjan Bhattacharjee. Their combined expertise fosters a creative environment that drives innovation.

Conclusion

Renuka Muralidhar's contributions to thermal cooling technology exemplify her commitment to innovation. Her patent demonstrates the potential for improved efficiency in thermal management systems. Renuka continues to be a valuable asset in her field, paving the way for future advancements.