Tainan, Taiwan

Ren-Shin Cheng


Average Co-Inventor Count = 5.6

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2017-2024

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3 patents (USPTO):

Title: Ren-Shin Cheng: Innovator in Package Carrier Technology

Introduction

Ren-Shin Cheng is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of three patents. His work focuses on enhancing the efficiency and reliability of package carriers used in electronic components.

Latest Patents

Cheng's latest patents include innovative designs that improve the functionality of package carriers. One of his patents is for a "Package carrier having a stiffener between solder bumps." This invention features a package carrier that includes a first redistribution structure layer, multiple conductive connecting members, a connection structure layer, at least one stiffener, and a molding compound. The conductive connecting members are strategically placed on the first surface of the redistribution structure layer, ensuring electrical connectivity. The stiffener is positioned between the conductive connecting members, enhancing the structural integrity of the package. Another significant patent is for a "Lead frame package," which comprises a first conductive layer, a first electronic component, lead frames, a second conductive layer, and a package body. This design encapsulates the electronic components effectively while ensuring reliable electrical connections.

Career Highlights

Ren-Shin Cheng is affiliated with the Industrial Technology Research Institute, where he continues to innovate in the field of electronic packaging. His work has been instrumental in advancing technologies that are crucial for modern electronics.

Collaborations

Cheng collaborates with esteemed colleagues such as Shih-Hsien Wu and Chien-Min Hsu, contributing to a dynamic research environment that fosters innovation.

Conclusion

Ren-Shin Cheng's contributions to electronic packaging technology through his patents demonstrate his commitment to innovation and excellence in the field. His work continues to influence the industry and pave the way for future advancements.

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