Location History:
- Tokyo, JP (2001 - 2003)
- Asahi, JP (2006)
Company Filing History:
3 out of 423 
1 out of 3 Years Active: 2001-2006
Title: The Innovative Contributions of Reishi Naka
Introduction
Reishi Naka is a notable inventor based in Asahi, Japan, recognized for his significant contributions to thermal insulation technology. With a total of three patents to his name, Naka has developed innovative methods and instruments that enhance the efficiency of heat insulation materials.
Latest Patents
Naka's latest patents include a thermal conductivity measurement method and instrument, as well as a method for producing a heat insulating material. The thermal conductivity measurement method involves generating heat between the object to be measured and a heat-resistant material. This process allows for the measurement of heat conductivity based on the temperature difference between two points of the heat-resistant material. Additionally, his method of producing a heat insulating material focuses on creating a vacuum insulation material by inserting a thermoplastic open-celled rigid foam into a gas barrier film packet, which is then evacuated and sealed. This innovative approach allows for the easy deformation of the vacuum insulation material, resulting in smaller yet highly effective insulation containers.
Career Highlights
Throughout his career, Reishi Naka has worked with prominent companies such as Nisshinbo Industries, Inc. and Eko Instruments Trading Co., Ltd. His experience in these organizations has contributed to his expertise in thermal insulation technologies and has facilitated the development of his patented inventions.
Collaborations
Naka has collaborated with several professionals in his field, including Masato Hayashi and Kiyotake Morimoto. These collaborations have likely enriched his work and contributed to the advancement of thermal insulation technologies.
Conclusion
Reishi Naka's innovative work in thermal insulation technology has led to the development of valuable patents that enhance the efficiency of heat insulating materials. His contributions continue to impact the field positively, showcasing the importance of innovation in addressing thermal conductivity challenges.