Sugar Land, TX, United States of America

Raymond W Thompson


Average Co-Inventor Count = 3.2

ph-index = 3

Forward Citations = 101(Granted Patents)


Company Filing History:


Years Active: 1985-2002

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4 patents (USPTO):Explore Patents

Title: Innovations of Raymond W. Thompson

Introduction

Raymond W. Thompson is a notable inventor based in Sugar Land, TX (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His work has advanced the technology used in electronic devices, making them more efficient and reliable.

Latest Patents

One of his latest patents is for a "Ball grid package with multiple power/ground planes." This innovative package is designed for flip chip integrated circuits and includes an interposer with electrical interconnections for signal, power, and ground contacts. The routing is accomplished on only two conductor layers, utilizing selective planes and buses. This design allows for multiple power planes on a single conductor level, supporting circuits with varying operating voltages. Another significant patent is the "Method of making plastic package for a surface mounted integrated circuit." This invention employs area array technology, such as conductive ball grid arrays, to package integrated circuit dies in a plastic body. The design features a molded plastic body with openings that allow for electrical connections to the electronic circuit.

Career Highlights

Raymond W. Thompson has had a distinguished career at Texas Instruments Corporation, where he has been instrumental in developing advanced packaging solutions for integrated circuits. His innovative designs have contributed to the efficiency and performance of electronic devices.

Collaborations

Throughout his career, Thompson has collaborated with notable colleagues, including Navinchandra Kalidas and John H. Abbott. These partnerships have fostered a creative environment that has led to groundbreaking advancements in the field of electronics.

Conclusion

Raymond W. Thompson's contributions to integrated circuit packaging have had a lasting impact on the electronics industry. His innovative patents and collaborative efforts continue to influence the development of more efficient electronic devices.

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