This inventor holds 4 USPTO granted patents. Top assignees: Johnson Matthey Inc., Avx Corporation. Active years: 1979-1984.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1979-1984
Title: The Innovations of Raymond L. Dietz
Introduction
Raymond L. Dietz is a notable inventor based in Poway, California. He has made significant contributions to the field of electronics, particularly in the development of bonding methods for electronic devices. With a total of 4 patents to his name, Dietz's work has had a lasting impact on the industry.
Latest Patents
Dietz's latest patents include a method of bonding an electronic device to a ceramic substrate. This innovation features a silver metallizing paste designed for the attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages. This paste is less expensive than a gold preform while being usable in hermetic packages. It provides better electrical and thermal conductivity, as well as higher bond strength than silver polyimides. The formulation consists of 25 to 95% silver blended with a low-melting glass, preferably one containing 95-96% PbO. A paste or ink is created with a suitable vehicle at 75-85% solids. The selection of the Ag:glass ratio depends on the type of die bonding to be used. This paste is particularly useful in MOS technology, where low contact resistance is essential. It also serves as a solder substitute and is effective in bonding chip capacitors. Notably, it is advantageous for attaching larger-area integrated circuits, as it avoids the stress cracking associated with the gold-silicon eutectic.
Career Highlights
Throughout his career, Dietz has worked with prominent companies such as Johnson Matthey Inc. and AVX Corporation. His experience in these organizations has contributed to his expertise in the field of electronic device bonding.
Collaborations
Dietz has collaborated with notable coworkers, including Michael Featherby and Peter K. Margetts. Their combined efforts have further advanced the innovations in electronic device technology.
Conclusion
Raymond L. Dietz's contributions to the field of electronics through his innovative patents and collaborations have significantly influenced the industry. His work continues to pave the way for advancements in electronic device bonding methods.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile