Location History:
- North Dartmouth, MA (US) (1984)
- South Dartmouth, MA (US) (1984)
Company Filing History:
Years Active: 1984
Title: The Innovations of Raymond J. Duff
Introduction
Raymond J. Duff is a notable inventor based in North Dartmouth, MA (US). He has made significant contributions to the field of electronic circuit packaging, holding a total of 2 patents. His work has paved the way for advancements in microcircuit technology.
Latest Patents
One of his latest patents is for a microcircuit package that allows for grounding of leads through a straightforward procedure. This innovation involves placing a braze preform over a lead, with a metal washer positioned above it. The assembly is then brazed, creating a low-resistance grounding connection between the lead and the package. Another significant patent is a brazing technique for packaging electronic circuits. This method provides a standard flat pack with a Thermkon base that is brazed to a Kovar frame using an intermediary ring of high thermal conductivity material. This design minimizes flashing during the brazing process, enhancing the efficiency of electronic circuit packaging.
Career Highlights
Raymond J. Duff has been associated with Isotronics, Inc., where he has applied his expertise in electronic packaging. His innovative approaches have contributed to the company's reputation in the industry.
Collaborations
Throughout his career, Duff has collaborated with notable colleagues such as Steven A. Tower and Jay S. Greenspan. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
Raymond J. Duff's contributions to the field of electronic circuit packaging demonstrate his innovative spirit and technical expertise. His patents reflect a commitment to improving technology and enhancing the efficiency of electronic devices.