Raymond F Thompson

Title: Innovations of Raymond F Thompson

Introduction

Raymond F Thompson is a notable inventor based in Kalispell, MT (US). He has made significant contributions to the field of semiconductor processing. His work focuses on developing systems that enhance the efficiency and cleanliness of processing integrated circuit wafers and similar units.

Latest Patents

Thompson holds a patent for a "Semiconductor processing system with wafer container docking and loading station." This innovative processor is designed for processing integrated circuit wafers, semiconductor substrates, data disks, and similar units that require very low contamination levels. The processor features an interface section that receives wafers in standard wafer carriers. It transfers the wafers from carriers onto novel trays, which improve processing efficiency. The interface unit can accommodate multiple groups of trays, and a conveyor with an automated arm assembly moves the wafers supported on these trays. The conveyor transports the trays from the interface along a track to several processing stations, which are accessed from an enclosed area adjoining the interface section.

Career Highlights

Thompson has dedicated his career to advancing semiconductor technology. His work at Semitool, Inc. has positioned him as a key player in the industry. His innovative designs and systems have contributed to the development of cleaner and more efficient processing methods.

Collaborations

Throughout his career, Thompson has collaborated with talented individuals such as Robert W Berner and Gary L Curtis. These collaborations have fostered an environment of innovation and have led to the development of groundbreaking technologies in semiconductor processing.

Conclusion

Raymond F Thompson's contributions to semiconductor processing technology are noteworthy. His innovative patent and collaborative efforts have significantly impacted the industry. His work continues to influence advancements in the field, ensuring cleaner and more efficient processing methods for integrated circuit wafers and similar units.