Company Filing History:
Years Active: 2001
Title: Innovations by Raymond Duff in Microelectronic Packaging
Introduction
Raymond Duff is an accomplished inventor based in North Dartmouth, MA (US). He has made significant contributions to the field of microelectronics, particularly in the packaging of microelectronic devices. His innovative approach has led to the development of a unique method that enhances the performance and reliability of these devices.
Latest Patents
Raymond Duff holds a patent for a method of making a package for microelectronic devices using iron oxide as a bonding agent. This patent describes a package that includes a thermally conductive base containing a metal composite, which consists of a high conductivity metal and a ferrous alloy. The base features a surface with an iron oxide deposit, which plays a crucial role in the bonding process. An insulating substrate is placed on the surface of the base, with an aperture that exposes part of the base for mounting the microelectronic device. Additionally, a conductive lead is embedded within the insulating substrate, allowing for electrical connection to the device. The bonding of the insulating substrate to the iron oxide deposit is achieved through heating, ensuring a robust and effective package.
Career Highlights
Raymond Duff has been associated with Stratedge Corporation, where he has applied his expertise in microelectronics. His work has not only advanced the technology in this field but has also contributed to the overall efficiency and effectiveness of microelectronic devices.
Collaborations
Throughout his career, Raymond has collaborated with notable colleagues, including John R. Robichaud and Donald C. Taber. These collaborations have fostered an environment of innovation and have led to further advancements in microelectronic packaging.
Conclusion
Raymond Duff's contributions to the field of microelectronics, particularly through his patented method of packaging, demonstrate his commitment to innovation. His work continues to influence the industry and enhance the performance of microelectronic devices.