N. Syracuse, NY, United States of America

Raymond A Shirk


Average Co-Inventor Count = 3.0

ph-index = 3

Forward Citations = 50(Granted Patents)


Location History:

  • N. Syracuse, NY (US) (1984)
  • North Syracuse, NY (US) (1987)

Company Filing History:


Years Active: 1984-1987

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3 patents (USPTO):Explore Patents

Title: Innovations of Raymond A. Shirk

Introduction

Raymond A. Shirk is a notable inventor based in North Syracuse, NY, with a significant contribution to the field of engineering. He holds three patents that showcase his innovative approach to technology and materials.

Latest Patents

One of his latest patents is for a metal core printed circuit board. This invention describes a novel circuit board comprising a metal substrate, a patternable metal foil, and an insulating layer of thermoplastic resin. The assembly process involves exceeding the glass transition temperature under pressure to bond the resin to the metal substrate and foil through high-temperature wetting. The circuit board is designed to provide holes lined with resin, ensuring strong adhesion and high performance. It is particularly advantageous for applications requiring good heat conductivity and high voltage performance.

Another significant patent by Shirk involves a method of electroding a poly(vinylidene fluoride) solid for piezoelectric applications. This method includes surface preparation through plasma etching to create molecular scale irregularities, followed by sputtering a metallic layer. The process ensures that the piezoelectric properties of the material remain intact while providing excellent adhesion between the electrode and the surface.

Career Highlights

Raymond A. Shirk is associated with General Electric Company, where he has made substantial contributions to various engineering projects. His work has been instrumental in advancing technologies that enhance the performance and reliability of electronic components.

Collaborations

Shirk has collaborated with notable colleagues, including Robert E. Belke, Jr. and Hsiu H. Lin, who have contributed to his innovative projects and research endeavors.

Conclusion

Raymond A. Shirk's contributions to the field of engineering through his patents reflect his commitment to innovation and excellence. His work continues to influence the development of advanced materials and technologies in the industry.

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