Company Filing History:
Years Active: 2000
Title: The Innovations of Randall A. Leggett
Introduction
Randall A. Leggett is a notable inventor based in Milton, Vermont, who has made significant contributions to the field of semiconductor device fabrication. With a focus on enhancing the efficiency and precision of photolithographic processes, Leggett's work has implications for the advancement of technology in various industries.
Latest Patents
Leggett holds a patent for a "Hot plate with in situ surface temperature adjustment." This invention presents an arrangement and method for controlling individual zones of a hot plate used in the post-exposure bake step of wafers during semiconductor device fabrication. The hot plate features temperature-controllable surface zones that support a standard single wafer. It includes loading means that orient the wafer on the hot plate. The design allows for segmentation into an array of individually controllable heating zones. Additionally, a thermal detection array, such as an infrared camera or pyroelectric detector, is mounted above the hot plate to monitor the wafer surface temperature across specific locations. This data is mapped into the hot plate zones and transmitted into a servo for zonal hot plate adjustment and temperature control.
Career Highlights
Leggett is associated with International Business Machines Corporation (IBM), where he has contributed to various innovative projects. His work in the semiconductor field has been instrumental in improving the manufacturing processes that are critical for modern electronics.
Collaborations
Throughout his career, Leggett has collaborated with notable colleagues, including James J. Colelli and Joseph Mundenar. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Randall A. Leggett's contributions to the field of semiconductor technology through his innovative patent demonstrate his commitment to advancing the industry. His work continues to influence the development of more efficient manufacturing processes in electronics.