Company Filing History:
Years Active: 2023-2025
Title: Innovations by Inventor Ran Cheng
Introduction
Ran Cheng is a notable inventor based in Markham, Canada. He has made significant contributions to the field of 3D point cloud processing, with a total of three patents to his name. His work focuses on advanced methods and systems that enhance the understanding and utilization of spatial data.
Latest Patents
Ran Cheng's latest patents include "Methods and systems for semantic segmentation of a point cloud" and "Method and system for real-time landmark extraction from a sparse three-dimensional point cloud." The first patent describes a deep neural network with two primary subsystems designed to process sparse 3D point clouds. This innovative system captures and fuses spatial feature information at multiple scales and hierarchical levels. The second patent outlines a method for processing a 3D point cloud to generate a segmented point cloud in real time. This method involves receiving data from a detection and ranging sensor and labeling data points to create a segmented output.
Career Highlights
Ran Cheng is currently employed at Huawei Technologies Co., Limited, where he applies his expertise in 3D point cloud technology. His work has positioned him as a key player in the development of advanced systems that leverage deep learning for spatial data analysis.
Collaborations
Ran Cheng collaborates with talented individuals such as Ryan Razani and Bingbing Liu. Their combined efforts contribute to the innovative projects at Huawei Technologies, enhancing the capabilities of 3D data processing.
Conclusion
Ran Cheng's contributions to the field of 3D point cloud processing through his patents and work at Huawei Technologies highlight his role as an influential inventor. His innovative methods are paving the way for advancements in spatial data analysis and application.