San Jose, CA, United States of America

Ramon C W Chea, Jr


Average Co-Inventor Count = 1.6

ph-index = 8

Forward Citations = 259(Granted Patents)


Company Filing History:


Years Active: 2001-2005

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15 patents (USPTO):Explore Patents

Title: Innovations of Ramon C W Chea, Jr.

Introduction

Ramon C W Chea, Jr. is a notable inventor based in San Jose, CA, with a remarkable portfolio of 15 patents. His work primarily focuses on high-density metallic cross-connect systems, showcasing his expertise in the field of telecommunications and cable management.

Latest Patents

One of his latest inventions is the "Smart cable for design of high density metallic cross connect systems." This invention aims to provide a smart cable system that enhances the installation process for high-density metallic cross-connect systems. It features visual indicators that assist cable installers in connecting cables to cards with minimal errors. Additionally, it includes a means for detecting the connections within the cross-connect system.

Another significant patent is the "Physical architecture for design of high density metallic cross connect systems." This invention addresses the challenges associated with physical interconnections in cross-connect switching systems. It enables scalable designs and structures for racks and shelves, facilitating interconnections at various levels, including devices-to-devices and boards-to-boards.

Career Highlights

Ramon C W Chea, Jr. is currently employed at Turnstone Systems, Inc., where he continues to innovate and contribute to advancements in telecommunications technology. His work has significantly impacted the efficiency and reliability of high-density systems.

Collaborations

Throughout his career, Ramon has collaborated with notable colleagues, including P Kingston Duffie and Timothy John Hodgkinson. These collaborations have further enriched his contributions to the field.

Conclusion

Ramon C W Chea, Jr. stands out as a prominent inventor in the telecommunications industry, with his innovative patents addressing critical challenges in high-density systems. His contributions continue to shape the future of cable management and connectivity solutions.

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