Company Filing History:
Years Active: 1997
Title: Ramachandra A Rao: Innovator in Integrated Circuit Technology
Introduction
Ramachandra A Rao is a notable inventor based in Pleasanton, CA (US). He has made significant contributions to the field of integrated circuit technology, holding 2 patents that showcase his innovative approach to enhancing performance and manufacturability.
Latest Patents
One of his latest patents is titled "Multi-layered, integrated circuit package having reduced parasitic noise." This invention presents a multi-layered, high-performance integrated circuit package designed with several features that improve its performance while minimizing parasitic noise generated within the package. The design includes metallic layers that connect contact fingers formed on ledges around the periphery of a die cavity area to their respective package pins. A ground metallic layer is strategically interposed between each pair of input/output signal metallic layers. Each input/output signal metallic layer is sandwiched between a pair of metallic layers, with one layer connected to a voltage supply and the other to a corresponding ground reference. This innovative arrangement helps to reduce noise and enhance the overall functionality of the integrated circuit package.
Career Highlights
Ramachandra A Rao is currently associated with VLSI Technology, Inc., where he continues to push the boundaries of integrated circuit design. His work has been instrumental in developing technologies that are crucial for modern electronic devices.
Collaborations
Throughout his career, he has collaborated with esteemed colleagues such as Chin-Ching Huang and Sang S Lee, contributing to a dynamic and innovative work environment.
Conclusion
Ramachandra A Rao's contributions to integrated circuit technology reflect his dedication to innovation and excellence. His patents not only enhance the performance of electronic devices but also pave the way for future advancements in the field.