Leesburg, IN, United States of America

Rama Rao V Gundlapalli


Average Co-Inventor Count = 3.3

ph-index = 2

Forward Citations = 57(Granted Patents)


Company Filing History:


Years Active: 2004-2011

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3 patents (USPTO):Explore Patents

Title: Innovations by Rama Rao V Gundlapalli

Introduction

Rama Rao V Gundlapalli is an accomplished inventor based in Leesburg, Indiana. He has made significant contributions to the field of joint prosthesis technology, holding a total of three patents. His work focuses on enhancing the functionality and reliability of prosthetic devices.

Latest Patents

Gundlapalli's latest patents include a "Prosthetic bearing with encapsulated reinforcement" and a "Joint replacement prosthesis component with non-linear insert." The first patent describes a joint prosthesis that features a bearing component positioned between two components for cooperation with long bones. This bearing component includes a reinforcing component fully encapsulated by a polymeric material, allowing for effective sterilization. The second patent outlines a joint prosthesis that incorporates a bearing component with a non-coincidental reinforcing component, enhancing its structural integrity and performance.

Career Highlights

Throughout his career, Gundlapalli has worked with notable companies such as DePuy Products, Inc. and Deput Products, Inc. His experience in these organizations has contributed to his expertise in developing innovative prosthetic solutions.

Collaborations

Gundlapalli has collaborated with esteemed colleagues, including Mark Alan Heldreth and Albert H Burstein. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and advancements in prosthetic technology.

Conclusion

Rama Rao V Gundlapalli's contributions to the field of joint prosthesis are noteworthy, showcasing his dedication to innovation and improvement in medical technology. His patents reflect a commitment to enhancing the quality of life for individuals requiring joint replacements.

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