Rama P Samudrala

Title: Innovations of Rama P Samudrala

Introduction

Rama P Samudrala is an accomplished inventor based in Upland, California. He is known for his innovative contributions to the field of electroforming and chemical milling processes. His work has significantly impacted the production of copper lead frame tapes, which are essential in various electronic applications.

Latest Patents

One of his notable patents is the "Electroformed and chemical milled bumped tape process." This process involves producing a copper lead frame tape where individual fingers are equipped with gold-plated bumps. The method begins with a copper foil that has dry film photoresist applied to both sides. The initial processing creates openings on one side of the resist for electroforming the end products directly on the copper foil. Further processing generates openings on the opposite side, allowing for chemical milling of the exposed copper. This results in a plurality of fingers, each featuring an integral bump and copper foil arrangement. The innovative double-cell electroplating method employed in this process enables the production of bump heights of up to 0.0013 inches or greater, ensuring uniformly excellent quality.

Career Highlights

Rama P Samudrala has made significant strides in his career while working at General Dynamics Corporation, Pomona Division. His expertise in electroforming and chemical milling has positioned him as a key player in the development of advanced manufacturing techniques. His contributions have not only enhanced product quality but also improved production efficiency.

Collaborations

Throughout his career, Rama has collaborated with several talented individuals, including William P Dugan and Grace A Rivas. These collaborations have fostered an environment of innovation and creativity, leading to the successful development of groundbreaking technologies.

Conclusion

Rama P Samudrala's innovative work in the field of electroforming and chemical milling has made a lasting impact on the electronics industry. His patent for the bumped tape process exemplifies his commitment to advancing manufacturing techniques. His career at General Dynamics Corporation highlights his contributions to technology and innovation.