Rainer Müller

Title: Rainer Müller: Innovator in Adhesion Promoters

Introduction

Rainer Müller is a notable inventor based in Schrobenhausen, Germany. He has made significant contributions to the field of microelectronics through his innovative work on adhesion enhancing layers. His expertise has led to the development of methods that improve the bonding of polymer coatings on metal surfaces.

Latest Patents

Rainer Müller holds a patent titled "Methods of using adhesion enhancing layers and microelectronic integrated modules including adhesion enhancing layers." This patent describes adhesion promoters for polymer coatings on metals, which are articulated into at least two head groups connected by a hydrocarbon spacer group. One head group is designed to react particularly well with polymer molecules, while the other forms a durable bond with a metal surface. The length of the spacer group ensures that a substance deposited on a metallic surface has hydrophobic properties. Suitable adhesion promoters can include sulfur compounds, amino compounds, and hydroxyl or carbonyl compounds. Additionally, the patent provides details on a plastic composite body, a compound, and a process for preparing the compound.

Career Highlights

Rainer Müller is currently associated with Infineon Technologies AG, where he continues to push the boundaries of innovation in microelectronics. His work has been instrumental in enhancing the performance and durability of electronic components.

Collaborations

Rainer has collaborated with several talented individuals in his field, including Alexandra Atzesdorfer and Klaus Heckmann. Their combined expertise has contributed to the advancement of technologies related to adhesion promoters.

Conclusion

Rainer Müller is a distinguished inventor whose work on adhesion enhancing layers has made a significant impact in the field of microelectronics. His innovative approaches continue to influence the development of advanced materials and technologies.