Company Filing History:
Years Active: 2017-2018
Title: Rainer Dudek: Innovator in Semiconductor Technology
Introduction
Rainer Dudek is a prominent inventor based in Chemnitz, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the performance and reliability of semiconductor packages.
Latest Patents
Rainer Dudek's latest patents include innovative designs for semiconductor packages. The first patent, titled "Semiconductor package with interlocked connection," describes a semiconductor package that features a block with opposing main surfaces and recessed regions. The encapsulation material fills these recessed regions, creating an interlocked connection that enhances the structural integrity of the package. The second patent, "Semiconductor module with interlocked connection," outlines a semiconductor package that includes a support substrate and a semiconductor die. A protrusion from the support substrate forms an interlocked connection with the encapsulation material, increasing the tensile strength at the interface.
Career Highlights
Rainer Dudek is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the industry.
Collaborations
Throughout his career, Rainer has collaborated with notable colleagues, including Georg Meyer-Berg and Reinhard Pufall. These collaborations have fostered innovation and have been instrumental in the development of new technologies in the semiconductor field.
Conclusion
Rainer Dudek is a key figure in semiconductor innovation, with a focus on creating robust and efficient semiconductor packages. His patents reflect his commitment to advancing technology in this critical area.