Company Filing History:
Years Active: 2024-2025
Title: Innovations of Rahul Karyappa in 3D Printing Technology
Introduction
Rahul Karyappa is an innovative inventor based in Singapore, known for his contributions to the field of 3D printing technology. He has been awarded 2 patents for his groundbreaking work, which focuses on creating advanced materials and methods for 3D printing.
Latest Patents
Karyappa's latest patents include a method for Freeform polymer precipitation (FPP) in microparticulate gels. This method involves printing a 3D freeform structure in an embedding medium using a specialized ink composition. The ink composition consists of a thermoplastic, a non-thermoplastic, a thermally degradable polymer, and/or a thermosensitive polymer dissolved in a solvent. The process allows for the precise dispensing of the ink through a nozzle into the embedding medium, resulting in the formation of a printed structure. The printed structure is maintained in the embedding medium until the immersion precipitation is completed, leading to the creation of the 3D freeform structure. Additionally, Karyappa has developed a chocolate-based ink for 3D printing, which includes a chocolate syrup, chocolate paste, or a combination thereof, along with cocoa powder. This edible and 3D printable ink composition remains in a single phase at temperatures ranging from 20° C. to 30° C.
Career Highlights
Rahul Karyappa is affiliated with the Singapore University of Technology and Design, where he continues to push the boundaries of 3D printing technology. His work has garnered attention for its innovative approach to combining materials science with practical applications in food technology and manufacturing.
Collaborations
Karyappa collaborates with Michinao Hashimoto, contributing to the advancement of research in 3D printing and material development.
Conclusion
Rahul Karyappa's contributions to 3D printing technology exemplify the potential of innovative materials and methods in transforming various industries. His patents reflect a commitment to advancing the field and exploring new possibilities in 3D printing applications.