Company Filing History:
Years Active: 1984-1985
Title: R Wilbur Herr: Innovator in Electroplating Solutions
Introduction
R Wilbur Herr is a notable inventor based in Troy, MI (US), recognized for his contributions to the field of electroplating. With a total of 2 patents, Herr has made significant advancements in the development of aqueous acid electroplating solutions and processes.
Latest Patents
Herr's latest patents include an innovative acid zinc and zinc alloy electroplating solution and process. This aqueous acid electroplating solution is designed for electrodepositing an adherent, ductile zinc, zinc-cobalt, zinc-nickel, and zinc-cobalt-nickel alloy deposit on a conductive substrate. The solution features a comparatively low concentration of boric acid to inhibit the formation of bath insoluble polyborate compounds. Additionally, it contains an effective amount of a polyhydroxy additive agent with at least three hydroxyl groups and at least four carbon atoms.
Another significant patent by Herr is for a zinc and zinc alloy electroplating bath and process. This aqueous bath is suitable for electrodepositing various zinc alloys, including zinc-nickel, zinc-cobalt, and zinc-iron combinations. The invention includes a brightening amount of an AB-type polyamide brightener, which is effective in producing an electrodeposit of the desired brightness.
Career Highlights
R Wilbur Herr is associated with Omi International Corporation, where he has been instrumental in advancing electroplating technologies. His work has contributed to the development of more efficient and effective electroplating processes.
Collaborations
Throughout his career, Herr has collaborated with notable coworkers, including Sylvia Martin and Alice M Strom. Their combined efforts have furthered the innovations in the field of electroplating.
Conclusion
R Wilbur Herr's contributions to electroplating solutions have established him as a key figure in the industry. His innovative patents reflect a commitment to enhancing the efficiency and effectiveness of electroplating processes.