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Title: Qing Wang: Innovator in Abrasive Technology and Acoustic Manipulation
Introduction
Qing Wang is a notable inventor based in Shanghai, China, recognized for his contributions to the fields of abrasive technology and acoustic manipulation. With a total of two patents to his name, Wang has made significant strides in developing innovative solutions that enhance efficiency and effectiveness in various applications.
Latest Patents
Wang's latest patents include a "Bonded Abrasive with Low Wetting Bond Material" and "Photoacoustic Tweezers." The bonded abrasive patent relates to a bonded abrasive body characterized by a specific MOR/EMOD ratio and bond volume percentage. This invention features an average Bond Post Area (BPA) and Bond Post Count (BPC) that optimize performance. The photoacoustic tweezers patent introduces a method and apparatus for trapping and manipulating particles using bimodal transducers. This technology allows for the simultaneous manipulation of multiple particles, ranging from 1 μm to 1 mm, in a versatile and biocompatible manner.
Career Highlights
Throughout his career, Qing Wang has worked with esteemed organizations such as Fudan University and Saint-Gobain Abrasives, Inc. His experience in these institutions has contributed to his expertise and innovative capabilities in his respective fields.
Collaborations
Wang has collaborated with notable colleagues, including Antoine Jean-Pierre Rene Riaud and Jia Zhou, who have contributed to his research and development efforts.
Conclusion
Qing Wang's innovative work in abrasive technology and acoustic manipulation showcases his commitment to advancing these fields. His patents reflect a blend of creativity and technical expertise, positioning him as a significant figure in the realm of invention.