Qin-Jia Cai

Title: Innovations by Qin-Jia Cai in Electronic Component Packaging

Introduction

Qin-Jia Cai is a notable inventor based in Singapore, recognized for his contributions to the field of electronic component packaging. With a total of 2 patents to his name, Cai has made significant strides in enhancing the efficiency and effectiveness of electronic component packaging processes.

Latest Patents

Cai's latest patents focus on a sophisticated packaging process for electronic components. This process begins with the provision of a semi-package unit that includes a first insulation layer and an electronic component, which is partially embedded within the insulation layer. The electronic component features at least one conducting terminal. Following this, a metal layer is formed over the surface of the semi-package unit, and a portion of this metal layer is removed to create a metal mask. This mask exposes the conducting terminals. Subsequently, a metal re-distribution layer is formed on both the metal mask and the conducting terminal. Finally, parts of both the metal re-distribution layer and the metal mask are removed, resulting in the production of at least one contact pad corresponding to the conducting terminal.

Career Highlights

Cai is currently employed at Delta Electronics International (Singapore) Pte Ltd, where he continues to innovate and develop new technologies in electronic packaging. His work has been instrumental in advancing the capabilities of electronic components, making them more efficient and reliable.

Collaborations

Cai collaborates with Da-Jung Chen, a fellow innovator in the field. Their partnership has fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Qin-Jia Cai's contributions to electronic component packaging demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the complexities involved in electronic packaging, paving the way for future advancements.