Company Filing History:
Years Active: 2024-2025
Title: Qian Sun: Innovating Multi-Path Connection Management
Introduction: Qian Sun, an accomplished inventor based in Cupertino, CA, has made significant strides in the realm of communication technology. With a focus on enhancing connectivity in devices, he is known for his innovative approach to multipath connection management.
Latest Patents: Qian Sun holds a patent for a groundbreaking invention titled "Multi-path Connection Management." This device integrates a system for managing multipath connections by utilizing first and second local communication interfaces along with a processor. The processor is designed to establish a primary connection for communication between the first local interface and a first remote interface of another device, while concurrently managing a secondary connection. Notably, this invention allows for the transmission of application and control data over the primary connection along with a concurrent transmission of control data over the secondary connection. It intelligently detects degradation in the primary connection's quality and adapts by switching connections as needed, demonstrating an advanced level of control and reliability.
Career Highlights: Currently employed at Apple Inc., Qian Sun's work is pivotal in pushing the boundaries of modern technology. His dedication and expert knowledge have contributed to the advancement of Apple’s communication devices, making them more efficient and resilient in data management.
Collaborations: Throughout his career, Qian has collaborated with notable professionals, including his coworker Daniel B. Pollack. Their joint efforts have likely fostered innovation and creativity within their projects, further enhancing the technological capabilities offered by their team.
Conclusion: Qian Sun's contributions, particularly in the field of multi-path connection management, exemplify the essence of innovation. As he continues to work with a leading company like Apple Inc., it is anticipated that his future inventions will further enhance communication methods and ensure a seamless connectivity experience in technology.