Company Filing History:
Years Active: 2014-2015
Title: Pui Chung Law: Innovator in Semiconductor Technology
Introduction
Pui Chung Law is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative packaging solutions for semiconductor devices, which are crucial for the advancement of electronic components.
Latest Patents
Pui Chung Law's latest patents include groundbreaking inventions in wafer-level device packaging and low-cost backside illuminated CMOS image sensor packages. The wafer-level device packaging invention relates to a semiconductor device that is packaged at the wafer level, allowing for the entire device to be formed before individual devices are separated. This innovation includes a semiconductor chip with bonding pads, a protective layer, and an insulation layer, resulting in a compact image sensor package that integrates a digital signal processor and memory chip.
The second patent, concerning a low-cost backside illuminated image sensor, eliminates the need for mechanical grinding or chemical-mechanical planarization processes in its fabrication. This invention features a semiconductor substrate with light sensing elements and a cavity that allows light to reach these elements effectively. The cavity is created through etching, which can be enhanced by agitation during the process.
Career Highlights
Pui Chung Law is affiliated with the Hong Kong Applied Science and Technology Research Institute Company, Limited. His work at this institution has allowed him to focus on advancing semiconductor technologies and contributing to the research community.
Collaborations
He has collaborated with notable coworkers, including Yat Kit Tsui and Dan Yang, who share his passion for innovation in semiconductor technology.
Conclusion
Pui Chung Law's contributions to semiconductor packaging and image sensor technology highlight his role as a leading inventor in the field. His patents reflect a commitment to advancing electronic components and improving manufacturing processes.