Priscilla Diep LaRosa

Title: Priscilla Diep LaRosa: Innovator in Chemical Mechanical Polishing

Introduction

Priscilla Diep LaRosa is a notable inventor based in San Jose, CA. She has made significant contributions to the field of chemical mechanical polishing, holding 2 patents that enhance the efficiency and effectiveness of polishing systems.

Latest Patents

One of her latest patents is titled "Wafer edge asymmetry correction using groove in polishing pad." This invention involves a chemical mechanical polishing system that includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing surface, and a controller. The polishing pad features a polishing control groove, and the carrier is designed to be laterally movable and rotatable. The controller synchronizes the lateral oscillation of the carrier head with its rotation, ensuring precise polishing of the substrate's edge.

Another significant patent is "Chemical mechanical polishing using time share control." This method involves rotating a polishing pad while positioning a substrate against it. The substrate is oscillated laterally across the polishing pad, allowing both the central and edge portions to be polished effectively. The method also includes holding the substrate in a fixed position to optimize the polishing process.

Career Highlights

Priscilla is currently employed at Applied Materials, Inc., where she continues to innovate in the field of semiconductor manufacturing. Her work focuses on improving polishing techniques that are crucial for the production of high-quality semiconductor devices.

Collaborations

Throughout her career, Priscilla has collaborated with talented individuals such as Jimin Zhang and Jianshe Tang. These collaborations have contributed to the advancement of her research and the successful development of her patents.

Conclusion

Priscilla Diep LaRosa is a pioneering inventor whose work in chemical mechanical polishing has made a significant impact on the semiconductor industry. Her innovative patents and contributions continue to shape the future of polishing technologies.