Location History:
- Signature Park, SG (2010)
- Signature Park, LK (2010)
- Moroga, CA (US) (2013)
Company Filing History:
Years Active: 2010-2013
Title: Innovations of Praveen Medis: A Pioneer in Thermal Management Technologies
Introduction
Praveen Medis is an accomplished inventor based in Singapore, known for his significant contributions to thermal management technologies. With a total of five patents to his name, Medis has developed innovative solutions that address critical challenges in heat dissipation for electronic devices.
Latest Patents
One of his latest patents is an LED bulb designed for high-intensity discharge bulb replacement. This system features a two-phase cooling apparatus that effectively cools an array of LED dies. Another notable invention is a semiconductor-based porous structure enabled by capillary force. This MEMS-based two-phase loop heat pipe (LHP) and capillary pumped loop (CPL) utilize semiconductor-grade silicon and advanced microlithographic techniques to achieve a planar configuration. The device operates without pumps or moving parts, efficiently moving heat at high power densities through revolutionary coherent porous silicon (CPS) wicks. These wicks minimize thermal mismatch stress and enhance the strength-to-weight ratio, making them ideal for cooling electronic and computer chips.
Career Highlights
Throughout his career, Praveen Medis has worked with esteemed organizations, including the University of Cincinnati and Progressive Cooling Solutions, Inc. His work has significantly advanced the field of thermal management, particularly in the development of microloop heat pipes that utilize cutting-edge microfabrication techniques.
Collaborations
Medis has collaborated with notable professionals in his field, including Ahmed Shuja and H. Thurman Henderson. These partnerships have contributed to the successful development and implementation of his innovative technologies.
Conclusion
Praveen Medis stands out as a leading inventor in the realm of thermal management technologies. His groundbreaking patents and collaborations reflect his commitment to advancing the efficiency of electronic cooling solutions.