San Jose, CA, United States of America

Prabal Upadhyaya

USPTO Granted Patents = 5 

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020-2024

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5 patents (USPTO):Explore Patents

Title: Innovations by Prabal Upadhyaya

Introduction

Prabal Upadhyaya is a notable inventor based in San Jose, California. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.

Latest Patents

One of his latest patents is for a semiconductor package that features a smart power stage and an E-fuse solution. This innovative package includes a lead frame, a low side metal-oxide-semiconductor field-effect transistor (MOSFET), an E-fuse MOSFET, a high side MOSFET, a metal connection, a gate driver, an E-fuse integrated circuit (IC), and a molding encapsulation. The design also incorporates a buck converter that comprises a smart power stage (SPS) network and an E-fuse solution network. The SPS network consists of a high side switch, a low side switch, and a gate driver. The drain of the low side switch is coupled to the source of the high side switch via a switch node, while the gate driver is connected to the gates of both switches. Additionally, the E-fuse solution network includes a sense resistor, an E-fuse switch, an E-fuse integrated circuit (IC), and an SD circuit.

Career Highlights

Throughout his career, Prabal Upadhyaya has worked with prominent companies in the semiconductor industry. He has been associated with Alpha and Omega Semiconductor International LP and Alpha and Omega Semiconductor (Cayman) Ltd. His experience in these organizations has contributed to his expertise in semiconductor innovations.

Collaborations

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Conclusion

Prabal Upadhyaya's contributions to semiconductor technology through his innovative patents highlight his role as a significant inventor in the field. His work continues to influence advancements in semiconductor packaging and power management solutions.

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