Company Filing History:
Years Active: 2023-2025
Title: Po-Wei Chiu: Innovator in Chip Package Technology
Introduction
Po-Wei Chiu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of chip package technology, holding a total of 2 patents. His work focuses on enhancing the performance and reliability of integrated circuits through innovative designs.
Latest Patents
Chiu's latest patents include a "Coupled loop and void structure integrated in a redistribution layer of a chip package." This invention provides a chip package and method for fabricating it, which includes a redistribution layer (RDL) featuring multiple loop and void structures. The RDL is strategically placed between the integrated circuit (IC) die and the package substrate, facilitating effective connectivity through RDL circuitry. The circuitry comprises a first coil in a first metal layer and a second coil in a second metal layer, enhancing the overall functionality of the chip package.
Another significant patent is the "Core cavity noise isolation structure for use in chip packages." This invention presents various noise isolation structures and methods for their fabrication. The substrate for the chip package includes a core region, top build-up layers, and bottom build-up layers. The routing circuitry in the bottom build-up layers is connected to that in the top build-up layers via vias through the core region. A void is incorporated in the bottom build-up layers, serving as a noise isolation structure, which is crucial for maintaining signal integrity.
Career Highlights
Po-Wei Chiu is currently employed at Xilinx, Inc., where he continues to innovate in the field of chip packaging. His expertise and contributions have positioned him as a key player in advancing technology within the semiconductor industry.
Collaborations
Chiu collaborates with various professionals in his field, including his coworker Hong Shi. Their combined efforts contribute to the development of cutting-edge technologies that enhance chip performance.
Conclusion
Po-Wei Chiu's work in chip package technology exemplifies innovation and dedication to improving integrated circuit designs. His patents reflect a commitment to advancing the semiconductor industry, making him a significant figure in this field.