Palatine, IL, United States of America

Piyush Chaudhari


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Piyush Chaudhari: Innovator in Glass/Metal Packaging Technology

Introduction

Piyush Chaudhari is a notable inventor based in Palatine, IL (US). He has made significant contributions to the field of packaging technology, particularly in the development of glass/metal packages for sensitive electronic components. His innovative approach has led to the creation of a patented method that enhances the reliability and performance of electronic devices.

Latest Patents

Piyush Chaudhari holds a patent for a "Glass/Metal package and method for producing the same." This invention involves a method of producing a glass/metal package where a glass portion is built around a provided leadframe using solderable and glass pastes. The process includes firing the materials to ensure proper adhesion and prevent microcracking at the glass/metal interface. The package is designed to create a sealed inert internal environment for sensitive electronic components, such as piezoelectric elements, and can be configured for leaded or surface mounting.

Career Highlights

Piyush Chaudhari is associated with Motorola Corporation, where he has applied his expertise in materials science and engineering. His work has contributed to advancements in packaging technology, which is crucial for the protection and performance of electronic devices. His innovative methods have set new standards in the industry.

Collaborations

Piyush has collaborated with esteemed colleagues, including John E. Mattson and William G. Skoda. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Piyush Chaudhari's contributions to glass/metal packaging technology exemplify the impact of innovation in the electronics industry. His patented methods not only enhance the performance of electronic components but also pave the way for future advancements in packaging solutions.

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