Pinxiang Duan

Title: Innovations by Pinxiang Duan in Wafer Scale Techniques

Introduction

Pinxiang Duan is a notable inventor based in Eindhoven, Netherlands. He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer scale techniques for interconnecting vertically stacked dies. His innovative approach has the potential to enhance the efficiency and performance of electronic devices.

Latest Patents

Duan holds a patent for a method and device that interconnects stacked die surfaces with electrically conductive traces. The patent, titled "Wafer scale technique for interconnecting vertically stacked dies," describes a process that involves bonding a second die on top of a first die using a photoresist compound. The method includes heating the first layer above the pyrolyzation point of the photoresist compound, allowing it to transition into a stable layer. Subsequently, a second layer of photoresist is deposited, and lithography is used to create a smooth convex bridge between the two die surfaces. An electrically conductive layer is then deposited on this bridge, forming a trace that connects the two dies.

Career Highlights

Pinxiang Duan is affiliated with the Technische Universiteit Eindhoven, where he continues to engage in research and development in semiconductor technologies. His work has garnered attention for its innovative approach to die interconnection, which is crucial for the advancement of compact and efficient electronic systems.

Collaborations

Duan collaborates with esteemed colleagues such as Elbertus Smalbrugge and Oded Raz, contributing to a dynamic research environment that fosters innovation and technological advancement.

Conclusion

Pinxiang Duan's contributions to wafer scale techniques exemplify the importance of innovation in the semiconductor industry. His patented methods not only enhance the interconnection of stacked dies but also pave the way for future advancements in electronic device performance.