Company Filing History:
Years Active: 2025
Title: The Innovative Contributions of Pingping Lei
Introduction
Pingping Lei is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of technology, particularly in the development of key assemblies and keyboards. His innovative designs have the potential to enhance user experience and functionality in various electronic devices.
Latest Patents
Pingping Lei holds a patent for a key assembly that includes a support plate, a flexible circuit board, a buffer block, and a pressing assembly. The support plate features a first surface and a second surface that are opposite to each other. It also has an accommodating portion that is recessed from the first surface to a side of the second surface, limiting an accommodating groove. The flexible circuit board is superposed on the first surface and has a through hole that connects to the accommodating groove. The buffer block is positioned in the accommodating groove and passes through the through hole, featuring a buffer support surface that protrudes from the flexible circuit board. The pressing assembly consists of a keycap, a support mechanism, and a connecting rod. This innovative design showcases his ability to integrate various components for improved functionality.
Career Highlights
Pingping Lei is currently associated with Honor Device Co., Ltd., where he continues to work on innovative projects. His experience and expertise in the field have allowed him to contribute to the advancement of technology in consumer electronics.
Collaborations
He has collaborated with talented coworkers such as Huijie Xu and Haitao Li, further enhancing the innovative environment at Honor Device Co., Ltd. Their combined efforts contribute to the development of cutting-edge technology.
Conclusion
Pingping Lei's contributions to the field of technology, particularly through his patent for a key assembly, highlight his innovative spirit and dedication to improving user experience in electronic devices. His work at Honor Device Co., Ltd. and collaborations with fellow inventors underscore the importance of teamwork in driving technological advancements.