Company Filing History:
3 out of 11,124 
1 out of 1 
1 out of 36 
Years Active: 2002-2006
Title: Innovations of Inventor Ping Wu
Introduction
Ping Wu is a notable inventor based in Cupertino, CA (US). He has made significant contributions to the field of integrated circuit technology, holding a total of 5 patents. His work focuses on enhancing the efficiency and functionality of electronic devices through innovative packaging and power management solutions.
Latest Patents
Among his latest patents is the "Multi-power ring chip scale package for system level integration." This invention presents a scalable multi-power integrated circuit package designed for integrated circuits with spaced apart chip power bonding pads. The package allows for a permanent conductive bond between the package bonding area and the chip bonding pad, facilitating improved power supply management. Another significant patent is the "Power ring architecture for embedded low drop-off voltage regulators." This integrated circuit features a power ring with an embedded low drop-off voltage regulator, optimizing the power delivery to connected circuits.
Career Highlights
Throughout his career, Ping Wu has worked with prominent companies such as Broadcom Corporation and Mobilink Telecom, Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in the field of electronics.
Collaborations
Ping Wu has collaborated with talented individuals in the industry, including Chinpo Chen and Datong Chen. These collaborations have contributed to the advancement of his projects and the successful development of his patents.
Conclusion
Ping Wu's contributions to integrated circuit technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative solutions continue to impact the electronics industry positively.