Baltimore, MD, United States of America

Philippe M Vereecken


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Innovations by Philippe M Vereecken

Introduction

Philippe M Vereecken is an accomplished inventor based in Baltimore, MD (US). He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative approaches to integrated circuit design.

Latest Patents

Vereecken holds a patent for a "Copper metallization structure and method of construction." This invention focuses on utilizing copper as via and interconnect structures for integrated circuits. The process he developed produces an interconnect layer of continuous copper with superior adhesion, requiring only a minimal number of steps for production. This innovation addresses the pressing need for reliable and performance-oriented vias and interconnect structures in semiconductor manufacturing, overcoming many issues associated with aluminum.

Career Highlights

Philippe M Vereecken is affiliated with The Johns Hopkins University, where he continues to advance research in semiconductor technologies. His work has been pivotal in enhancing the reliability and performance of integrated circuits.

Collaborations

Vereecken has collaborated with notable colleagues, including Gerko Oskam and Peter C Searson, contributing to the advancement of semiconductor research and development.

Conclusion

Philippe M Vereecken's innovative work in copper metallization for integrated circuits exemplifies the importance of advancements in semiconductor technology. His contributions are vital for the future of reliable and efficient electronic devices.

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