Corpataux, Switzerland

Philippe Chenaux



Average Co-Inventor Count = 2.4

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2009-2014

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2 patents (USPTO):Explore Patents

Title: Innovations by Philippe Chenaux in Adhesive Technologies

Introduction

Philippe Chenaux is an accomplished inventor based in Corpataux, Switzerland. He has made significant contributions to the field of adhesive technologies, holding a total of 2 patents. His work focuses on developing innovative adhesive systems that enhance bonding processes in various applications.

Latest Patents

Chenaux's latest patents include an "Adhesive system for the direct bonding of a cured polyurethane to crude rubber." This invention features an adhesive composition that utilizes a polyisocyanate compound and a polyester or vinyl ester resin. The composition is designed to bond cured polyurethane to uncured diene elastomer compositions, particularly in the manufacturing of rubber articles such as tires. Another notable patent is the "Adhesive composition for the direct joining of a pre-gelled polyester or vinyl ester to raw rubber." This sulfur-crosslinkable adhesive does not require water and allows for direct bonding of pre-gelled composites to uncured rubber, streamlining the manufacturing process.

Career Highlights

Throughout his career, Philippe Chenaux has worked with notable companies, including Conception et Développement Michelin S.A. His experience in the industry has allowed him to refine his expertise in adhesive technologies and contribute to advancements in the field.

Collaborations

Chenaux has collaborated with talented individuals such as Antonio Delfino and Corinne Deforel. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Philippe Chenaux's contributions to adhesive technologies demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of material science and engineering, paving the way for advancements in bonding applications.

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