Phil Wills

Title: Phil Wills - Innovator in Printed Circuit Board Assembly

Introduction

Phil Wills is a notable inventor based in Horsham, West Sussex, GB. He has made significant contributions to the field of electronics, particularly in the area of printed circuit board assembly. His innovative designs have paved the way for advancements in electronic manufacturing.

Latest Patents

Phil Wills holds a patent for a unique printed circuit board assembly. This assembly comprises a first printed circuit board (PCB) with a ball grid array (BGA) on its underside, and a second PCB facing the first PCB. The second PCB features at least one through-hole between its top and bottom surfaces, with its top surface printed with a circuit pattern bonded to the BGA. Additionally, a heat sink layer faces the bottom surface of the second PCB, having at least one thermally-conductive pin projecting normally into the through-hole. Each pin is accompanied by a thermally-conductive stud of the same cross-section as the pin, bonded to the BGA and disposed within the through-hole in thermal contact with the pin.

Career Highlights

Phil Wills is currently employed at Thales Holdings UK Plc, where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the efficiency and performance of electronic devices.

Collaborations

Phil has collaborated with several professionals in his field, including Emmanuel Loiselet. These collaborations have fostered a creative environment that encourages the exchange of ideas and technological advancements.

Conclusion

Phil Wills is a distinguished inventor whose work in printed circuit board assembly has made a significant impact on the electronics industry. His innovative designs and collaborations continue to drive progress in this vital field.